Stretchable films, methods of manufacturing the same and display devices including the same

ABSTRACT

A stretchable film includes a first region including a plurality of first patterns having a concave polygonal shape. The stretchable film also includes a second region including a plurality of second patterns having a concave polygonal shape. The stretchable film further includes a buffer region between the first region and the second region.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Divisional of U.S. patent application Ser. No.14/809,886, filed on Jul. 27, 2015, and claims priority and benefit fromKorean Patent Application No. 10-2014-0135628, filed on Oct. 8, 2014,which are incorporated by reference for all purposes as if fully setforth herein.

BACKGROUND

Example embodiments relate to stretchable films, methods ofmanufacturing the same and display devices including the same. Moreparticularly, exemplary embodiments relate to stretchable films havingauxeticity, methods of manufacturing the same and display devicesincluding the same.

Recently, a flexible display device including, e.g., an organic lightemitting display (OLED) device or a liquid crystal display (LCD) devicewhich may have stretchable and/or extensible properties has beenresearched.

For example, elements or devices of the display device may be formed ona flexible resin substrate to achieve the flexible display device.However, when the display device is attached on a surface having avariable curvature, sufficient flexible and/or wearable characteristicsmay not be realized only through the use of the flexible resinsubstrate.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

Exemplary embodiments provide a stretchable film having improvedflexibility and adhesion.

Exemplary embodiments provide a method of manufacturing a stretchablefilm having improved flexibility and adhesion.

Exemplary embodiments provide a display device including a stretchablefilm having improved flexibility and adhesion.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

An exemplary embodiment discloses a stretchable film that includes afirst region including a plurality of first patterns having a concavepolygonal shape, a second region including a plurality of secondpatterns having a convex polygonal shape, and a buffer region betweenthe first region and the second region.

An exemplary embodiment also discloses a stretchable film that includesa first region including a plurality of layers, the layers having anauxeticity and rigidities different from each other. The stretchablefilm also includes a second region including the plurality of thelayers, the layers in the second region being disposed in a differentorder from the layers disposed in the first region.

An exemplary embodiment further discloses a display device that includesa flexible base substrate, a pixel circuit and a light emittingstructure sequentially disposed on the flexible base substrate, and astretchable film attached on a bottom of the flexible base substrate,the stretchable film including a first region and a second region, whichare divided according to curvatures of an object, and the stretchablefilm including at least one of different patterns and different disposedstructures in each of the first region and the second region.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a top plan view illustrating a stretchable film in accordancewith an exemplary embodiment.

FIG. 2 is a top plan view illustrating a stretchable film in accordancewith an exemplary embodiment.

FIG. 3 is a schematic view illustrating an adhesion between astretchable film and an object in accordance with an exemplaryembodiment.

FIG. 4 is a flow chart illustrating a method of manufacturing astretchable film in accordance with an exemplary embodiment.

FIG. 5 is a schematic view illustrating an image transfer process on apreliminary film in accordance with an exemplary embodiment.

FIGS. 6 and 7 are schematic views illustrating image transfer processeson a preliminary film in accordance with an exemplary embodiment.

FIG. 8 is a cross-sectional view illustrating a stretchable film inaccordance with an exemplary embodiment.

FIG. 9 is a schematic view illustrating an adhesion between astretchable film and an object in accordance with an exemplaryembodiment.

FIG. 10 is a cross-sectional view illustrating a display device inaccordance with an exemplary embodiment.

FIGS. 11, 12, 13, and 14 are cross-sectional views illustrating a methodof manufacturing a display device in accordance with an exemplaryembodiment.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a top plan view illustrating a stretchable film in accordancewith an exemplary embodiment.

Referring to FIG. 1, a stretchable film 100 may have an auxeticity, andmay include a silicone-based resin material. The silicone-based resinmaterial may include a photo-patternable silicone (PPS).

As used herein, the term “auxeticity” may refer to a property thatexpands or contracts in a vertical or horizontal direction relative toan external force. For example, when a tensional force is appliedhorizontally to a portion of the stretchable film 100, the portion mayexpand vertically (or longitudinally). When a contractional force isapplied vertically to a portion of the stretchable film 100, the portionmay contract horizontally.

In exemplary embodiments, the stretchable film 100 may be divided into afirst region I and a second region II. In some embodiments, thestretchable film 100 may further include a buffer region III between thefirst region I and the second region II. The first and second regions Iand II may be connected to each other by the buffer region III.

In exemplary embodiments, the stretchable film 100 may include aplurality of openings and boundary patterns. The openings may beseparated from each other by the boundary patterns. Accordingly, thestretchable film 100 may have a net shape or a mesh shape due to theopenings and the boundary patterns.

The openings may include a first opening 115 and a second opening 125. Aplurality of the first openings 115 may be formed in the first region Iand a plurality of the second openings 125 may be formed in the secondregion II. In some embodiments, buffer openings 131, 133, 135, and 137may be included in the buffer region III.

The openings may be separated from each other by the boundary patterns.A first boundary pattern 110, a second boundary pattern 120, and abuffer boundary pattern 130 may be formed in the first region I, thesecond region II, and the buffer region III, respectively. In exemplaryembodiments, the boundary pattern may include a resin material havingthe auxeticity.

For example, the boundary pattern may include polydimethylsiloxane(PDMS) or polyurethane (PU). In some embodiments, the boundary patternmay include PPS.

In exemplary embodiments, the stretchable film 100 may be attached to anobject that may include surfaces having different curvatures. Forexample, the object may include a surface having a positive Gaussiancurvature (hereinafter, “a positive Gaussian surface”) and a surfacehaving a negative Gaussian curvature (hereinafter, “a negative Gaussiansurface”). The object may further include an inflection region betweenthe positive Gaussian surface and the negative Gaussian surface.

In some embodiments, the first region I, the second region II, and thebuffer region III of the stretchable film 100 may be attached to thepositive Gaussian surface, the negative Gaussian surface, and theinflection region of the object, respectively.

In exemplary embodiments, the first opening 115 included in the firstregion I may have a concave polygonal shape. In some embodiments, thefirst opening 115 may have a substantially ribbon shape as illustratedin FIG. 1.

In this case, a plurality of the first openings 115 having the ribbonshape may be arranged to define a first opening row A. A plurality ofthe first opening rows A, B, C, D, E, and F may be arranged in avertical direction. The first openings 115 in the neighboring firstopening rows (e.g., first openings in first opening rows A and B) may beadjacent to each other in a staggered arrangement so that a density ofthe first openings 115 in the first region I may be improved.

In exemplary embodiments, the second opening 125 included in the secondregion II may have a convex polygonal shape. In some embodiments, thesecond opening 125 may have a substantially hexagonal shape asillustrated in FIG. 1. Accordingly, the second region II may have a meshstructure of a substantially honeycomb shape.

The buffer region III may be interposed between the first and secondregions I and II to assist a structural change from the first opening115 to the second opening 125. For example, the buffer region III mayinclude the buffer openings so that the ribbon-shape opening may beconverted gradually into the hexagonal opening.

For example, the buffer opening may include different types of openingshaving different shapes. As illustrated in FIG. 1, the buffer openingmay include first, second, third, and fourth buffer openings 131, 133,135, and 137 sequentially arranged along a horizontal direction from thefirst region I to the second region II.

However, the shapes or structures of the buffer openings may not belimited to those illustrated in FIG. 1, and may be suitably modified sothat a structural transfer from the first opening 115 to the secondopening 125 may occur.

Although FIG. 1 illustrates the stretchable film 100 with one firstregion I and the second region II, exemplary embodiments may include thestretchable film 100 having a plurality of the first and second regionsI and II according to the curvatures of the object. The buffer regionIII may be included at each region between the first and second regionsI and II.

FIG. 2 is a top plan view illustrating a stretchable film in accordancewith an exemplary embodiment.

A stretchable film 200 of FIG. 2 may have constructions substantiallythe same as or similar to those of the stretchable film 100 illustratedin FIG. 1 except that stretchable patterns are formed instead of theopenings of FIG. 1.

In exemplary embodiments, a first boundary pattern 210 may be includedin a first region I of the stretchable film 200, and a plurality offirst stretchable patterns 215 may be separated from each other by thefirst boundary pattern 210. The first stretchable pattern 215 may have aconcave polygonal shape (e.g., a ribbon shape).

A second boundary pattern 220 may be included in a second region II ofthe stretchable film 200, and a plurality of second stretchable patterns225 may be separated from each other by the second boundary pattern 220.The second stretchable pattern 225 may have a convex polygonal shape(e.g., a hexagonal shape).

A buffer boundary pattern 230 may be included in a buffer region III ofthe stretchable film 200, and a plurality of buffer stretchable patternsmay be separated from each other by the buffer boundary pattern 230. Forexample, the buffer stretchable patterns may include first, second,third, and fourth buffer stretchable patterns 231, 233, 235, and 237having different shapes from one another along a horizontal directionfrom the first region I to the second region II.

In exemplary embodiments, the boundary patterns 210, 220, and 230 mayinclude a material having a rigidity greater than those of thestretchable patterns 215, 225, 231, 233, 235, and 237. For example, theboundary patterns 210, 220, and 230 may include a resin material havingan elastic modulus (e.g., Young's modulus) greater than a elasticmodulus of the stretchable patterns 215, 225, 231, 233, 235, and 237.

In some embodiments, the stretchable patterns 215, 225, 231, 233, 235,and 237 may include PDMS and/or PPS, and the boundary patterns 210, 220,and 230 may include PU.

When the stretchable film 200 is attached to the object, the stretchablepatterns 215, 225, 231, 233, 235, and 237 may be expanded or stretched.The boundary patterns 210, 220, and 230 may include a resin materialhaving the relatively high rigidity or modulus so that the stretchablepatterns 215, 225, 231, 233, 235, and 237 may be prevented from beingexcessively transformed or losing intrinsic elasticity.

FIG. 3 is a schematic view illustrating an adhesion between astretchable film and an object in accordance with an exemplaryembodiment.

Referring to FIG. 3, a stretchable film may be attached on an object 50including a plurality of curved surfaces. For example, the stretchablefilm of FIG. 1 or FIG. 2 may be attached on the object 50.

For convenience of descriptions, the stretchable film is denoted by areference numeral “100”, and detailed illustrations of the boundarypatterns, the openings, and the stretchable patterns included in thestretchable film 100 are omitted in FIG. 3. Dotted lines indicated inthe stretchable film 100 are virtual lines to represent expanding orstretching directions of the stretchable film 100.

The object 50 may include a positive Gaussian surface area PA, aninflection area IA, and a negative Gaussian surface area NA.

In exemplary embodiments, a first region I, a second region II, and abuffer region III of the stretchable film 100 may be attached on thepositive Gaussian surface area PA, the negative Gaussian surface areaNA, and the inflection area IA of the object 50, respectively.

As illustrated with reference to FIGS. 1 and 2, the first region I ofthe stretchable film 100 may include the opening or the stretchablepattern having the concave polygonal shape (e.g., the ribbon shape).Accordingly, the first region I of the stretchable film 100 may betransformed as a substantially dome shape to be adhered to the object50.

The second region II of the stretchable film 100 may include the openingor the stretchable pattern having the concave polygonal shape (e.g., thehexagonal shape). Accordingly, the second region II of the stretchablefilm 100 may be transformed as a substantially saddle shape to beadhered to the object 50.

The buffer region III of the stretchable film 100 may include the bufferopening or the buffer stretchable pattern so that a drastictransformation of the stretchable film 100 may be avoided between thefirst region I and the second region II. Thus, a looseness of thestretchable film 100 may be prevented at, e.g., the inflection area IAof the object 50.

As illustrated with reference to FIGS. 1 to 3, the stretchable film inaccordance with exemplary embodiments may include different types of theopenings or the stretchable patterns which may be optimally designed forcurvatures and structures of an object. Thus, when the stretchable filmis attached to the object, the stretchable film may be optimallyexpanded or stretched according to curved surfaces of the object.Therefore, the stretchable film may be adhered to the object without anylooseness or lifting-off from the object.

Additionally, polygonal parameters of the opening or the stretchablepattern included in the stretchable film, such as an internal angle, anexternal angle, or a length of a side, may be optimally modified so thatan adherence of the stretchable film may be further enhanced.

FIG. 4 is a flow chart illustrating a method of manufacturing astretchable film in accordance with an exemplary embodiment. FIG. 5 is aschematic view illustrating an image transfer process on a preliminaryfilm in accordance with an exemplary embodiment.

Referring to FIG. 4, in operation S10, curvatures of an object may bemeasured.

In exemplary embodiments, the object may include a plurality of curvedsurfaces having different curvatures. For example, the object mayinclude a positive Gaussian surface and a negative Gaussian surface asillustrated in FIG. 3.

A dimension of each of the curved surfaces corresponding to the measuredcurvature may be also measured in operation S10. Accordingly, data ofthe curvature and the dimension of each curved surface of the object maybe stored.

In operation S20, a pattern shape that may be formed in a stretchablefilm may be determined according to the curvature of the object. Apattern of the stretchable film may include an opening illustrated inFIG. 1 or a stretchable pattern illustrated in FIG. 2.

In some embodiments, if one area of the object has a positive Gaussiancurvature, a pattern shape of the stretchable film corresponding to thearea may be determined as a concave polygonal pattern. For example, theconcave polygonal pattern may include a ribbon-shape pattern.

In some embodiments, if one area of the object has a negative Gaussiancurvature, a pattern shape of the stretchable film corresponding to thearea may be determined as a convex polygonal pattern. For example, theconvex polygonal pattern may include a hexagonal pattern.

A pattern region for the pattern shape of the stretchable film may bealso determined in operation S20 according to the data on the dimensionof the curved surface of the object measured in operation S10. Forexample, as illustrated in FIGS. 1 and 2, dimensions of a first region Ifor the concave polygonal pattern and a second region II of the convexpolygonal pattern may be determined with respect to the stretchablefilm.

In some embodiments, a dimension of a buffer region III between thefirst and second regions I and II may be also determined.

Referring to FIGS. 4 and 5, in operation S30, the determined patternshapes may be transferred to the pattern regions of a preliminary film70 to obtain the stretchable film.

In some embodiments, the transfer process may include a photo process.In this case, the preliminary film may include a PPS film.

For example, a mask 60 including slits corresponding to the determinedpattern shapes may be prepared. The slits may have dimensions and shapescorresponding to the concave polygonal pattern and the convex polygonalpattern. Accordingly, the mask 60 may include a concave polygonal slit62 and a convex polygonal slit 64 substantially overlapping the firstregion I and the second region II of the stretchable film.

In some embodiments, buffer slits 66 having shapes substantially thesame as or similar to those of the buffer openings illustrated in FIG. 1may be formed between the concave polygonal slit 62 and the convexpolygonal slit 64.

The mask 60 may be disposed over the preliminary film 70, and anexposure process may be performed on the preliminary film 70 through themask 60. The exposure process may include an ultraviolet irradiation.

Thus, exposed portions of the preliminary film 70 through the slits 62,64, and 66 may be removed to obtain the stretchable film (e.g., asillustrated in FIG. 1).

The portions of the preliminary film 70 removed by the exposure processthrough the slits 62, 64, and 66 may be converted into the openingsillustrated in FIG. 1. For example, ribbon-shape openings may be formedat the pattern region determined as the first region I. Hexagonalopenings may be formed at the pattern region determined as the secondregion II.

In some embodiments, buffer openings may be formed at the pattern regionallotted as the buffer region III.

In some embodiments, the transfer process of operation S30 may beperformed through a molding process. For example, a mold may be preparedaccording to the pattern shape and the pattern region determined throughoperations S10 and S20. The mold may include slits substantially thesame as or similar to those of the boundary patterns illustrated in FIG.1.

A resin material such as PDMS or PU may be provided onto the mold sothat the slits may be filled with the resin material. After a curingprocess, a cured resin material may be detached from the mold tomanufacture the stretchable film of FIG. 1.

FIGS. 6 and 7 are schematic views illustrating image transfer processeson a preliminary film in accordance with an exemplary embodiment.

Referring to FIG. 6, a mask 60 a for a pattern transfer process mayinclude a boundary slit 68. The boundary slit 68 may have a shapesubstantially the same as or similar to those of the boundary patterns210, 220, and 230 illustrated in FIG. 2.

The mask 60 a may be disposed on a preliminary film 70 a, and anexposure process (e.g., a UV irradiation) may be performed on thepreliminary film 70 a through the boundary slit 68.

Referring to FIG. 7, portions of the preliminary film 70 a exposedthrough the boundary slit 68 (shown in FIG. 6) may be removed to form aboundary gap 75. Portions of the preliminary film 70 a surrounded by theboundary gap 75 may be defined as the first stretchable pattern 215, thesecond stretchable pattern 225, and the buffer stretchable patterns 231,233, 235, and 237 as illustrated in FIG. 2.

A resin material having relatively high rigidity or modulus such as PUmay be filled in the boundary gap 75. Then a curing process may beperformed to form a boundary pattern. The boundary pattern may includethe first boundary pattern 210, the second boundary pattern 220 and thebuffer boundary pattern 230 as illustrated in FIG. 2.

According to exemplary embodiments as described above, a curvature of anobject may be measured, a pattern shape may be determined according tothe measured curvature. The pattern shape may be transferred on adesired region of a stretchable film. Therefore, the stretchable filmthat may be optimally adhered on a surface of the object may beachieved.

FIG. 8 is a cross-sectional view illustrating a stretchable film inaccordance with an exemplary embodiment.

Referring to FIG. 8, a stretchable film 300 may include a first region Iand a second region II divided along a horizontal direction. In someembodiments, the stretchable film 300 may further include a bufferregion III inserted between the first and second regions I and II.

The first and second regions I and II may have a multi-layeredstructure. For example, the first and second regions I and II may have adouble-layered structure including layers of different rigidities.

The first region I of the stretchable film 300 may include a highrigidity layer 310 and a low rigidity layer 320 stacked on the highrigidity layer 310. The high rigidity layer 310 may include a resinmaterial having an elastic modulus greater than that of the low rigiditylayer 320. For example, the high rigidity layer 310 and the low rigiditylayer 320 may include PU and PDMS, respectively.

The second region II of the stretchable film 300 may have a reversearrangement of the first region I. For example, the second region II mayinclude the low rigidity layer 320 and the high rigidity layer 310stacked on the low rigidity layer 320.

A buffer pattern 330 may be disposed at the buffer region III of thestretchable film 300. In exemplary embodiments, the buffer pattern 330may include a resin material having a modulus between the high rigiditylayer 310 and the low rigidity layer 320. The buffer pattern 330 mayserve as an adhesion member between the first region I and the secondregion II.

In exemplary embodiments, a low rigidity material layer including, e.g.,PDMS, may be formed on a high rigidity material layer including, e.g.,PU, to obtain a preliminary film. The preliminary layer may be cut to bedivided into a first portion and a second portion. The second portionmay be flipped, and the first and second portions may be attachedthrough the buffer pattern 330 such that the different rigidity materiallayers may face each other in a horizontal direction. Accordingly, thestretchable film 300 of FIG. 8 may be manufactured.

In some exemplary embodiments, the stretchable film 300 may be obtainedby a molding process. For example, a high rigidity resin and a lowrigidity resin may be sequentially injected in a mold comparable to thefirst region I and then cured. The low rigidity resin and the highrigidity resin may be sequentially injected in a mold comparable to thesecond region II and then cured. Subsequently, a resin material may beinjected in a mold comparable to the buffer region III to form thebuffer pattern 330. Accordingly, the stretchable film 300 of FIG. 8 maybe achieved.

FIG. 9 is a schematic view illustrating an adhesion between astretchable film and an object in accordance with an exemplaryembodiment.

Referring to FIG. 9, and as also illustrated in FIG. 3, an object 50 mayinclude a positive Gaussian surface area PA and a negative Gaussiansurface area NA. An area between the positive Gaussian surface area PAand the negative Gaussian surface area NA may be defined as aninflection area IA.

The first region I, the second region II, and the buffer region III ofthe stretchable film 300 may be attached on the positive Gaussiansurface area PA, the negative Gaussian surface area NA, and theinflection area IA of the object 50, respectively.

The low rigidity layer 320 may be stretched more greatly relative to thehigh rigidity layer 310. Accordingly, an orientation of curvatures ofthe object 50 may be transferred or delivered in the stretchable film300 so that the stretchable film 300 may be adhered to the object 50without any looseness or lifting-off from curved surfaces of the object50.

Further, the buffer pattern 330 may prevent or absorb a distortion ofthe stretchable film 300 that may be caused by a conversion of thecurvature at the inflection area IA. Thus, a separation or a detachmentbetween the high rigidity layer 310 and the low rigidity layer 320 atthe inflection area IA or the buffer region III may be prevented.

FIG. 10 is a cross-sectional view illustrating a display device inaccordance with an exemplary embodiment. For example, FIG. 10illustrates an organic light emitting display (OLED) device.

A method of forming elements of the display device is also describedwith reference to FIG. 10.

Referring to FIG. 10, the display device may include a stretchable film100 attached to a bottom surface of a base substrate 400, and a pixelcircuit and a light emitting structure disposed on the base substrate400.

The base substrate 400 may include a polymer material having a flexibleproperty. For example, the base substrate 400 may include apolyimide-based material. Thus, the display device may be provided as aflexible OLED device.

A barrier layer 410 may be formed on the base substrate 400. An impuritydiffusion between the base substrate 400 and structures formed thereonmay be blocked by the barrier layer 410.

The barrier layer 410 may be formed of, e.g., silicon oxide or siliconnitride. In some embodiments, the barrier layer 410 may have amulti-stacked structure including a silicon oxide layer and a siliconnitride layer. The barrier layer 410 may cover an entire top surface ofa substantial portion of the base substrate 400.

In some embodiments, a buffer layer may be further formed on the barrierlayer 410 using silicon oxide, silicon nitride, and/or siliconoxynitride.

An active layer 415 may be formed on the barrier layer 410. For example,a semiconductor material layer may be formed on the barrier layer 410,and patterned by a photolithography process to form the active layer415.

The semiconductor material layer may be formed using amorphous siliconor polysilicon. For example, an amorphous silicon layer may be formed onthe barrier layer 410, and then a crystallization process such as a lowtemperature polycrystalline silicon (LTPS) process or a laser annealingprocess to form the semiconductor material layer including polysilicon.

Alternatively, the semiconductor material layer may be formed of asemiconductor oxide such as indium gallium zinc oxide (IGZO), zinc tinoxide (ZTO), or indium tin zinc oxide (ITZO).

A gate insulation layer 420 may be formed on the buffer layer 410 tocover the active layer 415. For example, the gate insulation layer 420may be formed of silicon oxide, silicon nitride, or silicon oxynitrideby a CVD process, a spin coating process, or the like.

The gate electrode 425 may be formed on the gate insulation layer 420.The gate electrode 425 may be substantially superimposed over the activelayer 415. For example, a first conductive layer may be formed on thegate insulation layer 420, and then patterned to form the gate electrode425 overlapping the active layer 415.

The first conductive layer may be formed using a metal such as aluminum(Al), silver (Ag), tungsten (W), copper (Cu), nickel (Ni), chrome (Cr),molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium(Nd), scandium (Sc), etc., an alloy of the listed metals, or a nitrideof the listed metals. These may be used alone or in a combinationthereof. Alternatively, the first conductive layer may be formed of atransparent conductive material such as indium tin oxide (ITO), indiumzinc oxide (IZO) or aluminum doped zinc Oxide (AZO).

In some embodiments, impurities may be implanted to the active layer 415using the gate electrode 425 as an implantation mask, such that a sourceregion and a drain region may be formed at both ends of the active layer415. A portion of the active layer 415 between the source region and thedrain region may serve as a channel region substantially overlapping thegate electrode 425.

An insulating interlayer 430 may be formed on the gate insulation layer420 to cover the gate electrode 425. The insulating interlayer 430 maybe formed of silicon oxide, silicon nitride, or silicon oxynitride. Insome embodiments, the insulating interlayer 430 may be formed as amulti-layered structure including a silicon oxide layer and a siliconnitride layer.

A source electrode 433 and a drain electrode 435 may be formed throughthe insulating interlayer 430 and a gate insulation layer 420. Thesource electrode 433 and the drain electrode 435 may be in contact withthe active layer 415.

For example, the insulating interlayer 430 and the gate insulation layer420 may be partially etched to form contact holes through which theactive layer 415 is exposed. A second conductive layer filling thecontact holes may be formed on the insulating interlayer 430, andpatterned to form the source electrode 433 and the drain electrode 435.The source electrode 433 and the drain electrode 435 may be in contactwith the source region and the drain region of the active layer 415,respectively.

The second conductive layer may be formed using a process and a materialsubstantially the same as or similar to those for the first conductivelayer.

Accordingly, a thin film transistor (TFT) including the active layer415, the gate insulation layer 420, the gate electrode 425, the sourceelectrode 433, and the drain electrode 435 may be formed. For example,at least one TFT may be formed on each pixel of the display device. Insome embodiments, a switching TFT and a driving TFT may be formed on theeach pixel of the display device. Further, a capacitor may be alsoformed on the each pixel of the display device.

In some embodiments, the display device may include a data line and ascan line. The scan line may be patterned from the first conductivelayer to be connected to the gate electrode 415. The data line may bepatterned from the second conductive layer to be connected to the sourceelectrode 433.

Accordingly, the pixel circuit including the data line, the scan line,and the TFT may be formed on the base substrate 400.

A via insulation layer 440 covering the source electrode 433 and thedrain electrode 435 may be formed on the insulating interlayer 430.

In exemplary embodiments, the via insulation layer 440 may be formedusing an organic material, such as a polyimide, an epoxy-based resin, anacryl-based resin, or polyester. The via insulation 440 may have asufficiently large thickness such that a top surface of the viainsulation layer 440 may be substantially leveled or planar.

The above mentioned barrier layer 410, the semiconductor material layer,the first and second conductive layers, the gate insulation layer 420,the insulating interlayer 430, and the via insulation layer 440 may beformed by at least one of a chemical vapor deposition (CVD) process, aplasma enhanced chemical vapor deposition (PECVD) process, a highdensity plasma-chemical vapor deposition (HDP-CVD) process, a thermaldeposition process, a vacuum evaporation process, a spin coatingprocess, a sputtering process, an atomic Layer deposition (ALD) process,and a printing process.

The light emitting structure including a first electrode 450, anemitting layer 470, and a second electrode 480 may be formed on the viainsulation layer 440.

The first electrode 450 may be formed on the via insulation layer 440and may be electrically connected to the drain electrode 435

For example, the via insulation layer 440 may be partially etched toform a via hole through which the drain electrode 435 may be exposed. Athird conductive layer filling the via hole may be formed on the viainsulation layer 440 and patterned to form the first electrode 450.

In exemplary embodiments, the third conductive layer may be formed usinga metal such as Al, Ag, W, Cu, Ni, Cr, Mo, Ti, Pt, Ta, Nd, or Sc, or analloy of the listed metals, by a thermal deposition process, a vacuumevaporation process, a sputtering process, an ALD process, a CVDprocess, or a printing process. In some embodiments, the thirdconductive layer may be formed of a transparent conductive material,such as ITO, IZO, zinc oxide, or indium oxide.

The first electrode 450 may serve as a pixel electrode or an anode ofthe display device. The first electrode 450 may be individually providedfor each pixel.

A pixel defining layer (PDL) 460 may be formed on the via insulationlayer 440. The PDL 460 may cover a peripheral portion of the firstelectrode 450. For example, a photosensitive organic material such as apolyimide resin or an acryl resin may be coated, exposed, and developedto form the PDL 460.

The emitting layer 470 may be formed on the first electrode exposed bythe PDL 460. The second electrode 480 may be formed on the emittinglayer 470 and the PDL 460.

A predetermined voltage may be applied to the first and secondelectrodes 450 and 480 generating holes and electrons. The holes andelectrons may combine with each other to generate excitons. The excitonsmay be transferred to a ground state so that a light may be emitted.

In exemplary embodiments, a hole transport layer (HTL) may be furtherformed between the emitting layer 470 and the first electrode 450. Anelectron transport layer (ETL) may be further formed between theemitting layer 470 and the second electrode 480.

The emitting layer 470 may include light emitting materials forgenerating different colors of light (e.g., red, green, or blue). Theemitting layer 470 may have a multi-layered structure for generating awhite color of light.

The HTL may include a hole transport material, such as,4,4′-bis[N-(1-naphtyl)-N-phenylamino]biphenyl (NPB),4,4′-bis[N-(3-methylphenyl)-N-phenylamino]biphenyl (TPD),N,N′-di-1-naphtyl-N,N′-diphenyl-1,1′-biphenyl-4,4′-diamine (NPD),N-phenylcarbazole, polyvinylcarbazole, or a combination thereof.

The ETL may include an electron transport material, such as,tris(8-quinolinolato)aluminum (Alq3),2-(4-biphenylyl)-5-4-tert-butylphenyl-1,3,4-oxadiazole (PBD),bis(2-methyl-8-quinolinolato)-4-phenylphenolato-aluminum (BAlq),bathocuproine (BCP), triazole (TAZ), phenylquinozaline, or a combinationthereof.

The emitting layer 470 may be formed by a spin coating process, a rollprinting process, a nozzle printing process, an inkjet printing process,a transfer process using a donor substrate, etc. In some embodiments,the emitting layer 470 may be patterned to be confined by sidewalls ofthe PDL 460.

The second electrode 480 may be formed of a metal such as Li, Ca,LiF/Ca, LiF/Al, Al, Mg, Ag, Cr, W, Mo, or Ti, or an alloy thereof.Alternatively, the second electrode 480 may be formed of a transparentconductive material such as ITO, IZO, AZO, zinc oxide, or tin oxide. Thesecond electrode 480 may be formed by a sputtering process, an ALDprocess, PVD process, a PLD process, or a printing process.

The second electrode 480 may extend on a plurality of pixels and mayserve as a common electrode of the display device.

In some embodiments, an encapsulation layer including a flexible polymermaterial may be formed on the second electrode 480.

A stretchable film 100 according to exemplary embodiments may beattached on a bottom of the base substrate 400. As illustrated in FIG.1, the stretchable film 100 may include different types of openingsdesigned according to regions to which the display device is attached.

In some embodiments, the display device may include the stretchable filmof FIG. 2. In this case, the stretchable film 200 may include differenttypes of stretchable patterns designed according to the regions to whichthe display device is attached.

In some embodiments, the display device may include the stretchable film300 of FIG. 8. In this case, the stretchable film 300 may include a highrigidity layer and a low rigidity layer which may be stacked indifferent orders according to the regions to which the display device isattached.

In some embodiments, the display device may further include acalibration sensor 150. The calibration sensor 150 may be embedded inthe stretchable film 100, or may be disposed at a region adjacent to aninterface of the base substrate 400 and the stretchable film 100.

The calibration sensor 150 may recognize an image distortion when thestretchable film 100 is attached to an object and stretched or expanded.The distorted image may be amended into a planar image by thecalibration sensor 150.

In some embodiments, the calibration sensor 150 may be provided for eachregion of the stretchable film 100. For example, the calibration sensor150 may be provided for each of the first region I and the second regionII corresponding to a positive Gaussian surface and a negative Gaussiansurface of the object, respectively. Thus, the image distortions ofdifferent orientations may be amended by a plurality of the calibrationsensors 150.

The calibration sensor 150 may include a Flex sensor, an accelerationsensor, or a gyro sensor.

As described above, the display device may include the stretchable film100 that may be optimally designed according to a curvature variation ofthe object. The stretchable film 100 may be attached on the bottom ofthe base substrate 400 having a flexible property. Thus, a wearabledisplay device without an image distortion and free from a lift-off fromthe object may be achieved.

FIGS. 11 to 14 are cross-sectional views illustrating a method ofmanufacturing a display device in accordance with exemplary embodiments.For example, FIGS. 11 to 14 illustrate a method of manufacturing thedisplay device of FIG. 10.

Detailed descriptions on processes and materials substantially the sameas or similar to those illustrated with reference to FIG. 10 are omittedfor brevity.

Referring to FIG. 11, a base substrate 400 may be formed on a carriersubstrate 500.

The base substrate 400 may be supported on the carrier substrate 500while performing a device process on the base substrate 400. A glasssubstrate or a metal substrate may be used as the carrier substrate 500.

In exemplary embodiments, a composition including a polyimide precursormay be coated on the carrier substrate 500 to form a coating layer. Thenthe coating layer may be thermally cured. The polyimide precursorincluded in the coating layer may be polymerized during the curingprocess to form the base substrate 400 including a polyimide resin.

Referring to FIG. 12, and as also described with reference to FIG. 10, apixel circuit and a light emitting structure including an emitting layer470 may be formed on the base substrate 400.

Referring to FIG. 13, the carrier substrate 500 may be separated ordetached from the base substrate 400 such that a bottom surface of thebase substrate 400 may be exposed.

For example, the carrier substrate 500 may be separated from the basesubstrate 400 by, e.g., a laser-lift process. Alternatively, the carriersubstrate 500 may be pulled by a vacuum lifter or by manpower to bedetached from the base substrate 400.

Referring to FIG. 14, a stretchable film 100 may be attached on thebottom surface of the base substrate 400 to obtain the display device inaccordance with exemplary embodiments.

In exemplary embodiments, a calibration sensor 150 may be embedded inthe stretchable film 100. Then the stretchable film 100 may be attachedto the base substrate 400. In some embodiments, the calibration sensor150 may be attached to the bottom surface of the base substrate 400, andthen the stretchable film 100 may be attached to the substrate to coverthe calibration sensor 150.

According to exemplary embodiments as described above, a stretchablefilm may include patterns or stacked structures having different shapesor materials according to a curvature construction of an object. Thus,the stretchable film may be optimally expanded or stretched according toa curvature change of the object. Therefore, the stretchable film may beadhered to a curved surface of the object without looseness ordistortion. The stretchable film may be implemented to a flexibledisplay device having a wearable property or any other flexible display.

The foregoing is illustrative of exemplary embodiments and is not to beconstrued as limiting thereof. Although a few exemplary embodiments havebeen described, those skilled in the art will readily appreciate thatmany modifications are possible in the exemplary embodiments withoutmaterially departing from the novel teachings and advantages of thepresent inventive concept. Accordingly, all such modifications areintended to be included within the scope of the present inventiveconcept as defined in the claims. Therefore, it is to be understood thatthe foregoing is illustrative of various exemplary embodiments and isnot to be construed as limited to the specific exemplary embodimentsdisclosed, and that modifications to the disclosed exemplaryembodiments, as well as other exemplary embodiments, are intended to beincluded within the scope of the appended claims.

What is claimed is:
 1. A stretchable film, comprising: a first regioncomprising a plurality of layers, the plurality of layers having anauxeticity and rigidities different from each other; and a second regioncomprising the plurality of layers, wherein the plurality of layersdisposed in the second region are arranged in a different order from theplurality of layers disposed in the first region in a thicknessdirection of the plurality of layers.
 2. The stretchable film of claim1, wherein the first region comprises a high rigidity layer and a lowrigidity layer stacked on the high rigidity layer, the second regioncomprises the low rigidity layer and the high rigidity layer disposed onthe low rigidity layer, and the high rigidity layer has an elasticmodulus greater than an elastic modulus of the low rigidity layer. 3.The stretchable film of claim 2, wherein the high rigidity layercomprises polyurethane, and the low rigidity layer comprisespolydimethylsiloxane.
 4. The stretchable film of claim 2, wherein thefirst region is attached on a positive Gaussian surface of an object andthe second region is attached on a negative Gaussian surface of theobject.
 5. The stretchable film of claim 4, further comprising a bufferpattern between the first region and the second region, wherein thebuffer pattern is attached on an inflection surface of the object. 6.The stretchable film of claim 5, wherein the buffer pattern comprises aresin material, an elastic modulus of the resin material is between theelastic modulus of the high rigidity layer and the elastic modulus ofthe low rigidity layer.